MSc Microelectronics and Chip Design
A two-year Master's programme focused on semiconductor design, where every student designs and tests a physical chip.
Best for:Best for engineering and physics graduates seeking specialized expertise in semiconductor and integrated circuit design.
Overview
The Master of Science in Microelectronics and Chip Design at the Technical University of Munich is a comprehensive four-semester program addressing the global shortage of skilled semiconductor professionals. Offered as part of the collaborative Edu4Chip initiative, the curriculum covers foundational theory, front-end and back-end design, and culminates in a mandatory chip tape-out project and Master's thesis. Students benefit from an international framework with study abroad opportunities and close industry connections. Applicants undergo a rigorous two-stage aptitude assessment to demonstrate their readiness for advanced microelectronics training.
What you'll do
- Complete rigorous coursework spanning foundational digital and analogue design in the first semester
- Progress through advanced front-end and back-end design methodologies in subsequent semesters
- Participate directly in a practical chip design project involving a complete tape-out cycle
- Conduct independent research and analysis culminating in a Master's thesis during the final semester
- Engage in collaborative study and optional mobility windows across partner institutions within the Edu4Chip network
Requirements
Degree required: Bachelor's degree in Electrical Engineering, Computer Science with a minor in Electrical Engineering, Physics, or an equivalent qualification
Degree offered: Master of Science
Language: English; IELTS Academic 6.5, TOEFL iBT 88, or PTE Academic 65
Instruction: English
- Foundational knowledge in mathematics, electronics, and programming
- Academic background in electrical engineering, computer science, or physics
- Analytical aptitude demonstrated through university transcripts and entrance assessments
- Open to applicants of all nationalities meeting admission standards
- Must successfully pass the two-stage aptitude assessment process
Funding & terms
Programme and admissions
Admissions not verified
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- Intake
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- Prerequisites
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- Tuition
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How to apply
Deadline: 2027-05-31
Applicants must submit their application materials through the TUM online application portal within the specified application window. The admissions process includes a two-stage evaluation involving qualification assessment followed by an interview.
- CV
- Bachelor's degree certificate and transcripts
- English language proficiency certificate
Contact
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