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Electrical Engineering and Electronics● Open★ EU-FUNDED⏰ 2 days leftPreview

PhD Position in RF HEMTs Characterization and Device Modelling

Join FORTH-IESL’s APECS project to advance RF HEMTs characterization and modelling for electronic systems.

Best for:Best for candidates with a master’s degree in physics, electrical engineering, or a related field, interested in RF electronics, device characterization, and computational modelling.

Foundation for Research and Technology Hellas (FORTH) · Heraklion, Greece · R1 · First-stage researcher
More professors at Foundation for Research and Technology Hellas (FORTH)
RF HEMTs characterizationDevice modellingElectronic components and systemsAdvanced packaging technologyHigh-frequency electronics
Deadline
Oct 16, 2026
2 days
Funding
Stipend
Unknown (Horizon Europe – COFUND funded)
Start date
2026-12-01
Temporary
Location
Heraklion
Greece

Overview

This PhD position at the Institute of Electronic Structure and Laser (IESL) of the Foundation for Research and Technology Hellas (FORTH) focuses on the DC, AC distortion, and RF characterization of RF HEMTs (High Electron Mobility Transistors). The successful candidate will engage in data analysis, measurement setup, and device modelling within the Horizon Europe-funded APECS project. The role is ideal for applicants with a strong background in computational physics or related fields, seeking to contribute to cutting-edge research in electronic components and systems. The position offers a temporary contract starting December 1, 2026, and is part of a collaborative effort to develop advanced packaging and heterogeneous integration technologies.

RF HEMTsElectronic packagingDevice characterizationComputational modellingHeterogeneous integrationElectronics researchHorizon EuropePhD position Greece

What you'll do

  • Conduct DC, AC distortion, and RF characterization of RF HEMTs.
  • Develop and optimize measurement setups for device characterization.
  • Perform data analysis and modelling of electronic device performance.
  • Collaborate with project partners on advanced packaging and integration technologies.
  • Contribute to research outputs, including publications and conference presentations.

Requirements

Degree required: Master’s degree or equivalent in Physics, Electrical Engineering, or a related field

Degree offered: PhD

Language: English; proficiency sufficient for academic research and collaboration

Instruction: English

Required skills
  • Experience in RF electronics or semiconductor device characterization
  • Proficiency in computational modelling and data analysis techniques
  • Familiarity with measurement setups for electronic devices
  • Strong background in physics or electrical engineering principles
Nice to have
Experience with simulation tools (e.g., SPICE, MATLAB, Python for data analysis)Knowledge of advanced packaging technologiesPublication record in relevant scientific journals or conferences
Eligibility
  • Open to applicants with a master’s degree or equivalent
  • No specific nationality or residency restrictions mentioned

Funding & terms

Type
Stipend
Amount
Unknown (Horizon Europe – COFUND funded)
Duration
3 years (typical PhD duration)
Programme
Horizon Europe – COFUND
EU-FUNDEDHorizon Europe – COFUND

How to apply

Deadline: 2026-10-16 (Europe/Athens)

Applicants must submit their application through the official FORTH-IESL job portal. The application should include a CV, a cover letter, and any relevant academic documents. Detailed instructions are available on the FORTH-IESL website.

Documents required
  • Curriculum Vitae (CV)
  • Cover letter
  • Master’s degree certificate and transcripts
  • Academic references (if applicable)
↗Apply via form

Contact

FORTH-IESL· Institute of Electronic Structure and Laser

http://www.iesl.forth.gr

Lab
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS)
Foundation for Research and Technology Hellas (FORTH)
Horizon Europe – COFUNDGreece
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