Junction defect characterization of low thermal budget SOI MOSFET
Investigate advanced junctions for 3D sequential integration in MOSFETs through physical and electrical characterization.
Best for:Best for microelectronics or nanotechnology graduates interested in semiconductor physics and advanced device integration.
Overview
This PhD position is hosted jointly at CEA-Leti and CROMA under the supervision of Daphnée Bosch. The research focuses on analyzing the junction defects of novel transistors fabricated under restricted thermal budgets for 3D sequential integration. The candidate will engage in simulation, process understanding, cleanroom integration management, and extensive physical and electrical characterization. The findings will be disseminated through presentations and peer-reviewed articles.
What you'll do
- Conduct literature reviews, simulations, and TCAD modeling to conceptualize junction structures.
- Investigate process steps including ion implantation and solid-phase epitaxial regrowth.
- Manage integration and cleanroom fabrication workflows.
- Perform physical and electrical characterizations such as noise measurements and Deep-Level Transient Spectroscopy.
- Valorize research findings through scientific presentations and journal publications.
Requirements
Degree required: Master's degree in microelectronics, nanotechnologies, or a related field
Degree offered: PhD
Language: English or French proficiency (no strict minimum specified)
Instruction: English / French
- Background in microelectronics or nanotechnologies
- Familiarity with semiconductor physics and device classes
- Strong analytical and problem-solving skills for complex technical puzzles
- Ability to collaborate effectively within an interdisciplinary research team
Funding & terms
How to apply
Deadline: 2026-11-30
Interested candidates should review the application portal and submit their CV along with supporting documents before the deadline. Contact the supervisor via email for informal inquiries.
- CV
Contact
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