Joint International Master in Semiconductor Chip Integration and Innovation

This Erasmus Mundus Master’s programme offers a unique international experience in semiconductor chip integration and innovation. Students study at three leading European universities—Aalto University (Finland), University of South-Eastern Norway (Norway), and Budapest University of Technology and Economics (Hungary)—gaining hands-on laboratory training, industry collaboration, and mobility across Europe. The curriculum blends semiconductor physics, chip design, smart systems, digital twins, and AI, preparing graduates for careers in semiconductor manufacturing, microelectronics, smart technology, and research. With a focus on sustainability, entrepreneurship, and interdisciplinary problem-solving, the programme equips students with advanced engineering skills and an international professional network. Graduates are well-positioned for roles in industry, academia, or further doctoral studies, addressing global challenges in technology and innovation.

• Design, fabricate, model, and integrate intelligent electronic systems using cutting-edge semiconductor technologies.
• Conduct hands-on laboratory training in microfabrication, cleanroom processing, and semiconductor device characterisation.
• Develop advanced engineering skills through coursework, research projects, and industry collaborations.
• Participate in mobility across three European universities, gaining exposure to diverse academic and industrial perspectives.
• Work on a master’s project with academic or industrial partners, specialising in areas like chip design, smart systems, or AI applications.
• Collaborate in multidisciplinary teams to solve real-world engineering challenges.
• Develop entrepreneurial and intercultural skills through workshops, internships, and industry interactions.