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Materials Science and Microelectronics● OpenPreview

PhD in Advanced Microelectronics Structural Analysis Using Dark-Field X-Ray Microscopy

Explore cutting-edge dark-field X-ray microscopy to analyze strain and defects in next-generation microelectronics at CEA-Leti.

Best for:Best for materials science PhD candidates with expertise in microscopy, nanotechnology, and computational modeling, seeking interdisciplinary research at the intersection of microelectronics and synchrotron techniques.

Université Grenoble Alpes · Grenoble, France · R1 · First-stage researcher
More professors at Université Grenoble Alpes
dark-field X-ray microscopy (DFXM)microelectronics strain analysisthermomechanical stress in nanoscale devicessynchrotron-based materials characterizationmultiscale modeling in nanoelectronicsquantum technologies and photonics
Deadline
Oct 31, 2026
16 days
Funding
Salaried
CEA salary (tuition fee: 391 EUR/year)
Start date
2026-09-01
Full-time
Location
Grenoble
France

Overview

This PhD position focuses on leveraging dark-field X-ray microscopy (DFXM) to investigate advanced microelectronic architectures under thermomechanical stress. The project, based at CEA-Leti’s Nanocharacterization platform, will develop a methodology for multiscale strain analysis in complex devices without sample destruction. Collaborations with ESRF’s ID03 beamline and complementary techniques like TEM and Raman spectroscopy will enable 3D mapping of strain, orientation, and buried defects. The research aims to enhance reliability and design optimization for quantum technologies, photonics, and energy-efficient microelectronics. The successful candidate will contribute to both fundamental and applied science in nanoelectronics.

dark-field X-ray microscopymicroelectronics reliabilitynanoscale defect analysissynchrotron techniquesfinite-element simulationsTEM and Raman spectroscopymultiscale strain mappingCEA-Leti collaboration

What you'll do

  • Develop and apply dark-field X-ray microscopy (DFXM) to analyze strain and crystalline defects in advanced microelectronic architectures with nanometer resolution.
  • Perform comparative studies using complementary synchrotron techniques (e.g., Laue microdiffraction, scanning X-ray diffraction microscopy) and local probes (TEM, Raman spectroscopy).
  • Conduct finite-element simulations to model mechanical behavior under thermal and operational loads, supporting experimental interpretation.
  • Establish a robust methodology for multiscale strain analysis in microelectronics, bridging macroscopic and atomic-scale observations.
  • Collaborate with ESRF’s ID03 beamline team and CEA-Leti’s Nanocharacterization platform to integrate DFXM into device reliability workflows.
  • Publish findings in peer-reviewed journals and present results at international conferences in materials science and microelectronics.
  • Contribute to the optimization of next-generation devices for quantum technologies, photonics, and energy efficiency.

Requirements

Degree required: Master's degree (or equivalent) in Materials Science, Physics, Microelectronics, or a related engineering discipline.

Degree offered: PhD

Language: English (no formal proficiency test required; fluency in scientific communication expected)

Instruction: French and English

Required skills
  • Proven expertise in materials characterization techniques (e.g., microscopy, spectroscopy).
  • Experience with synchrotron-based experiments or similar high-resolution imaging methods.
  • Familiarity with computational modeling tools (e.g., finite-element methods, molecular dynamics).
  • Strong laboratory skills in nanofabrication or cleanroom environments.
  • Ability to work collaboratively in interdisciplinary teams (materials science, physics, engineering).
  • Proficiency in scientific writing and oral presentation in English.
Nice to have
Prior experience with dark-field X-ray microscopy or related techniques (e.g., X-ray diffraction, electron microscopy).Knowledge of microelectronics device physics or thermomechanical stress analysis.Familiarity with programming languages (e.g., Python, MATLAB) for data analysis and simulation.Publication record in top-tier journals or conferences in materials science or related fields.
Eligibility
  • No nationality restrictions; open to international applicants.
  • No prior residency requirements specified.
  • No age limits mentioned.
  • No prior experience caps beyond the master’s degree requirement.

Funding & terms

Type
Salaried
Amount
CEA salary (tuition fee: 391 EUR/year)
Duration
3 years (36 months)
Programme
CEA (Commissariat à l'Énergie Atomique et aux Énergies Alternatives)
CEA (Commissariat à l'Énergie Atomique et aux Énergies Alternatives)

How to apply

Deadline: 2026-10-31

Applicants must submit their CV, a cover letter outlining their research interests and motivation, and a research proposal (if required) through the Campus France portal. Additional documents may include academic transcripts, letters of recommendation, and proof of English proficiency (if applicable).

Documents required
  • CV
  • Cover letter
  • Research proposal (if required)
  • Academic transcripts (BSc + MSc)
  • Letters of recommendation (number not specified)
  • Proof of English proficiency (if not fluent)
↗Apply on site

Contact

Patrice Gergaud· Supervisor

patrice.gergaud@cea.fr

04 38 78 31 43

PG
Prof.
Patrice Gergaud
Laboratoire Propriétés des Matériaux et Structures
Lab
Département des Plateformes Technologiques (LETI)
Université Grenoble Alpes
France
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