PhD in Multi-Material Additive Manufacturing for Advanced Chip Cooling
Develop ultra-efficient cooling solutions for next-gen semiconductor packaging using advanced materials and additive manufacturing.
Best for:Best for materials scientists, thermal engineers, or additive manufacturing experts with expertise in semiconductor integration and a strong background in materials characterization and thermal analysis.
Overview
The University of Twente offers a fully funded 4-year PhD position focused on advancing chip cooling technologies through multi-material additive manufacturing. This project, part of the UltraCool initiative, aims to address thermal bottlenecks in advanced semiconductor packaging by designing novel interlayer alloys and optimizing Laser Powder Bed Fusion (LPBF) processes. The successful candidate will work on thermodynamic design, powder characterization, process optimization, and fabricating cooling demonstrators for direct and indirect chip cooling applications. The research integrates materials science, thermal engineering, and semiconductor integration to tackle the challenges posed by high heat fluxes in modern electronics.
What you'll do
- Design and optimize novel interlayer alloys for advanced chip cooling applications.
- Develop and characterize powder feedstocks for multi-material LPBF processes.
- Optimize LPBF process parameters to achieve high thermal conductivity in copper–silicon interfaces.
- Investigate interfacial physics governing residual stress, defect formation, and thermal transport.
- Fabricate and validate package-level cooling demonstrators for direct and indirect chip cooling.
- Conduct characterization using SEM, EBSD, XRD, thermal conductivity analysis, and thermomechanical testing.
- Collaborate with interdisciplinary teams to integrate cooling solutions into semiconductor packaging.
Requirements
Degree required: Master's degree in Materials Science, Mechanical Engineering, or a related field.
Degree offered: PhD
Language: English; proficiency suitable for academic research and collaboration
Instruction: English
- Expertise in materials science and additive manufacturing, preferably LPBF.
- Experience with materials characterization techniques (SEM, EBSD, XRD).
- Strong background in thermal engineering and semiconductor integration.
- Familiarity with computational modeling and simulation tools.
- Hands-on experience with experimental setups for thermal and mechanical testing.
- Open to international applicants.
- No specific residency or nationality restrictions mentioned.
Funding & terms
How to apply
Deadline: 2026-10-31
Interested applicants should apply online through the University of Twente’s careers portal. Submit your CV, a motivation letter, and academic transcripts. Shortlisted candidates will be invited for an interview.
- CV
- Motivation letter
- Academic transcripts
- Letters of recommendation (if required)
Contact
First Last· PhD Supervisor
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