PhD in Fan-Out Wafer Level Packaging Microfabrication Optimization
Optimising microfabrication processes for micropillars in Fan-Out Wafer Level Packaging.
Best for:Best for physics or materials science master's graduates with a strong background in microfabrication and semiconductor packaging.
Overview
This doctoral position focuses on the optimisation of microfabrication processes for micropillars applied in Fan-Out Wafer Level Packaging (FOWLP). Based in the Grand Est region of France, the project operates within the field of physics and advanced semiconductor packaging technologies. The successful candidate will engage in rigorous experimental research, process optimization, and microfabrication development. Applicants are expected to hold a relevant master's degree and demonstrate a strong background in microfabrication or semiconductor physics.
What you'll do
- Develop and optimise microfabrication processes for micropillars in Fan-Out Wafer Level Packaging.
- Conduct cleanroom-based experiments and process characterisation.
- Analyze experimental data to improve manufacturing yield and reliability.
- Collaborate with academic and industrial partners on advanced packaging solutions.
- Prepare scientific publications, technical reports, and present findings at conferences.
Requirements
Degree required: Master's degree in Physics, Materials Science, Microelectronics, or related field
Degree offered: PhD
Language: French and English proficiency as required by the doctoral school
Instruction: French / English
- Strong background in microfabrication techniques
- Experience with cleanroom processes and equipment
- Proficiency in experimental data analysis
- Knowledge of semiconductor packaging technologies
- Applicants must hold a master's degree or equivalent prior to the start of the contract
Funding & terms
How to apply
Deadline: 2026-11-30
Interested candidates should submit their application through the official doctoral portal before the stated deadline. Ensure all required academic and personal documents are attached to the submission.
- CV
- Cover letter
- Master's transcripts
- Academic diplomas
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