Dies to wafer direct bonding: from physical mechanisms to the development of thin stackable dies

This PhD position at the Laboratoire LETI (Grenoble INP) focuses on the physical mechanisms of direct dies-to-wafer bonding. The research aims to explore edge effects and implement novel bonding processes to overcome current planarization challenges in microelectronics. The candidate will contribute to projects involving silicon photonics and 3D hybrid bonding applications. This role offers the opportunity to develop thin stackable chips as a technological alternative to traditional damascene processes.

• Conduct experimental research on direct dies-to-wafer bonding mechanisms.
• Analyze edge effects in small-scale die bonding processes.
• Develop and optimize new direct bonding techniques for thin stackable chips.
• Collaborate with research teams on silicon photonics and 3D integration projects.
• Address surface planarization challenges in high-topography environments.
• Document research findings and contribute to technical reports and publications.