PhD Position: 3D Interconnects for Quantum Processor Units

This PhD position at Université Grenoble Alpes, hosted within the CEA-LETI laboratory, focuses on developing 3D interconnect technologies for next-generation quantum processors. The research aims to address critical scaling challenges by utilizing techniques such as flip-chip bonding, multi-layer wiring, and through-silicon vias (TSV). The successful candidate will work at the intersection of materials science, technology, and physics to characterize the electrical and radiofrequency properties of these interconnects. The role involves designing test vehicles, managing fabrication processes, and conducting low-temperature measurements to assess their impact on quantum device performance.

• Design and layout of test vehicles for 3D quantum interconnects.
• Manage the fabrication process of quantum device test structures.
• Conduct low-temperature electrical and radiofrequency characterization of samples.
• Perform detailed data analysis to evaluate the impact of 3D integration on quantum properties.
• Write technical reports and contribute to scientific publications.