Electrical characterization and optimization of III-V HBT on Si for 6G and datacom applications
Develop high-performance InP-based HBTs on silicon to enable next-generation 6G and AI datacenter communications.
Best for:Best for candidates with a strong background in semiconductor physics, RF characterization, and device modeling.
Overview
This PhD position at the Laboratoire des Transistors Avancés (LETI) focuses on the development of InP-based Heterojunction Bipolar Transistors (HBTs) integrated on silicon substrates. The research aims to overcome current silicon technology limitations for Sub-THz frequency power amplifiers and high-speed optical drivers in AI datacenters. The successful candidate will perform electrical characterization, simulate device parasitics, and collaborate with process engineers to optimize device architecture. This role is essential for advancing high-speed, energy-efficient communication technologies.
What you'll do
- Conduct comprehensive electrical characterization of various device geometries and technological splits.
- Perform DC and RF measurements including IV curves, thermal analysis, S-parameters, and Load-Pull.
- Develop simulations to analyze key parasitics and evaluate new device architectures.
- Collaborate with process engineers to correlate electrical performance with fabrication parameters.
- Contribute to the optimization of device architecture to enhance RF performance and thermal management.
Requirements
Degree required: Master's degree in Electrical Engineering, Physics, or a related field.
Degree offered: PhD
Language: English proficiency required for research and reporting.
Instruction: English
- Strong understanding of semiconductor device physics.
- Experience with RF measurement techniques and equipment.
- Proficiency in device simulation and modeling tools.
- Ability to work in a collaborative, multidisciplinary research environment.
Funding & terms
How to apply
Deadline: 2026-11-30
Interested candidates should contact the supervisor via email with their application materials. Ensure all required documents are prepared for submission.
- CV
- Cover letter
- Academic transcripts
Contact
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