PhD Opportunity in Materials and Semiconductor Engineering
Advance semiconductor nano-membranes and flexible optoelectronics as part of an industrial collaborative PhD research chair.
Best for:Best for master's graduates in engineering or materials science with a strong interest in semiconductor fabrication and optoelectronics.
Overview
The Interdisciplinary Institute for Technological Innovation (3IT) at the Université de Sherbrooke invites applications for a PhD position focusing on materials science and semiconductor engineering. Operating under the Umicore Research Chair in Semiconductor Nano-Membranes and Flexible Optoelectronics, the research involves close collaboration with Teledyne Dalsa. The candidate will explore the PEELER process to develop defect-free heteroepitaxial wafers aimed at revolutionizing short-wave infrared (SWIR) device applications. The successful applicant is expected to conduct rigorous experimental and analytical research, contribute to collaborative milestones, and disseminate findings through academic and industrial channels.
What you'll do
- Investigate and optimize the PEELER process for semiconductor manufacturing
- Fabricate and characterize defect-free heteroepitaxial wafers
- Collaborate with academic researchers and industrial partners including Teledyne Dalsa
- Analyze experimental data to evaluate material performance and structural properties
- Prepare scientific reports, technical documentation, and peer-reviewed publications
Requirements
Degree required: Master Degree or equivalent
Degree offered: PhD
Language: English; good proficiency required
Instruction: English
- Strong background in materials science or semiconductor engineering
- Demonstrated ability to conduct independent experimental research
- Familiarity with semiconductor fabrication or characterization techniques
- Strong analytical and problem-solving capabilities
- Hold a Master Degree or equivalent qualification
Funding & terms
How to apply
Deadline: 2026-12-03 (UTC)
Interested candidates should submit their application documents directly via email to the designated recruitment address with the specified subject line. Ensure all required academic records and supporting documents are attached before the deadline.
- CV
- BSc + MSc transcripts
Contact
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