PhD Candidate Position in Advanced Packaging and Heterogeneous Integration
Join the APECS Marie Skłodowska-Curie Actions Doctoral Network to research advanced electronic packaging and heterogeneous integration.
Best for:Best for master's graduates in electrical engineering, materials science, or related disciplines with a strong background in electronic packaging.
Overview
This PhD candidate position is part of the APECS project focusing on advanced packaging and heterogeneous integration for electronic components and systems. The researcher will engage in cutting-edge doctoral research supported by the Marie Skłodowska-Curie Actions framework. The successful candidate will work within a collaborative academic and industrial network to develop innovative packaging solutions. Applicants are expected to conduct rigorous research, contribute to project deliverables, and actively participate in network training activities.
What you'll do
- Conduct independent and collaborative research on advanced packaging and heterogeneous integration technologies
- Design, fabricate, and test electronic components and packaging prototypes
- Collaborate with academic and industrial partners within the APECS network
- Publish research findings in peer-reviewed journals and present results at international conferences
- Participate in training schools, workshops, and secondments organized by the Doctoral Network
Requirements
Degree required: Master of Science or equivalent degree in Electrical Engineering, Materials Science, Physics, or a related field
Degree offered: PhD
Language: English; strong written and spoken proficiency
Instruction: English
- Strong background in electronic packaging or semiconductor device fabrication
- Experience with characterization and testing of electronic components
- Ability to conduct independent research and problem-solving
- Good communication and teamwork skills for working in an international network
- Must comply with the Marie Skłodowska-Curie Actions mobility rule
- Must not have resided or carried out main activity in the host country for more than 12 months in the 3 years immediately prior to the recruitment date
Funding & terms
How to apply
Deadline: 2026-10-16
Interested applicants must submit their application documents through the official external application link provided on the portal before the stated deadline.
- CV
- Cover letter
- Academic transcripts
- Reference letters
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