PhD in New Metallurgies for Low-Temperature Hybrid Bonding in Fan-Out Wafer Level Packaging

Explore innovative metallurgies for low-temperature hybrid bonding to advance microelectronics packaging technologies.

Best for:Best for master’s graduates in materials science, mechanical engineering, or chemical engineering with a strong interest in microelectronics and metallurgical innovations.

Université de Sherbrooke · Sherbrooke, Canada · R1 · First-stage researcher

More professors at Université de Sherbrooke

Low-temperature hybrid bondingAlternative metallurgies for microelectronicsFan-Out Wafer Level Packaging (FOWLP)Copper oxidation mitigationAdhesive dielectric materialsMicroelectronic interconnection technologies

Deadline

Dec 30, 2026

76 days

Funding

—

3 years (typical PhD duration)

Start date

1 January 2027

Full-time

Location

Sherbrooke

Canada

Overview

This PhD position at Université de Sherbrooke focuses on developing alternative metallurgies for low-temperature hybrid bonding in Fan-Out Wafer Level Packaging (FOWLP). The project addresses challenges in copper-based approaches, such as oxidation and high processing temperatures, aiming to enable more efficient and compact microelectronic systems. The candidate will conduct research at the Interdisciplinary Institute for Technological Innovation (3IT) and C2MI, collaborating with multidisciplinary teams in a cutting-edge environment. The work involves literature reviews, material development, process optimization, and characterization of bonding interfaces. This opportunity is ideal for engineers and scientists passionate about advancing microelectronics and packaging technologies.

PhD in microelectronicslow-temperature bondingalternative metallurgiesFOWLPmaterials engineeringcleanroom researchinterconnection technologiesmicroelectronics packaging

What you'll do

Conduct a focused literature review on copper oxidation challenges and alternative metals for low-temperature bonding.
Develop and characterize alternative metallurgies for interconnections, ensuring compatibility with adhesive dielectric materials and low electrical resistance.
Optimize protection strategies for copper interconnections, such as barrier layers or coatings, to prevent oxidation and improve wettability.
Define and optimize die-to-wafer (D2W) bonding process conditions for reliable and high-performance bonding interfaces.
Perform morphological, electrical, and mechanical characterizations to evaluate adhesion quality and interface robustness.
Collaborate with multidisciplinary teams in a cleanroom environment to advance microelectronic packaging technologies.

Requirements

Degree required: Master’s degree or equivalent in Mechanical Engineering, Materials Engineering, Chemical Engineering, or a related field

Degree offered: PhD

Language: English; good proficiency required

Instruction: English

Required skills

Strong background in materials science or microelectronics engineering
Experience with metallurgical processes or material characterization techniques
Familiarity with cleanroom environments and microfabrication processes
Proficiency in conducting literature reviews and scientific research
Ability to perform morphological, electrical, and mechanical testing

Nice to have

Experience with computational modeling or simulation tools for materials scienceKnowledge of advanced packaging technologies or hybrid bonding processesFamiliarity with industry-standard software for materials characterization

Eligibility

Open to international applicants
No specific residency or nationality restrictions mentioned
No age limits specified

Funding & terms

Type

Unknown

Amount

—

Duration

3 years (typical PhD duration)

Programme

Other EU programme

Université de Sherbrooke

How to apply

Deadline: 2026-12-30 (America/Toronto)

Interested candidates should send their application via email to inpaqt@usherbrooke.ca. The email subject should clearly state the position title. Ensure your application includes all required documents.

Documents required