PhD Position in Multi-Material Additive Manufacturing for Advanced Chip Cooling
Develop ultra-efficient cooling technologies for semiconductor packaging using multi-material additive manufacturing.
Best for:Best for researchers with a background in mechanical or materials engineering and a strong interest in additive manufacturing and thermal management.
Overview
The University of Twente is offering a 4-year, fully funded PhD position focused on the UltraCool project, which aims to solve thermal management bottlenecks in high-performance computing. The research involves developing novel interlayer alloys and multi-material Laser Powder Bed Fusion (LPBF) processes to enable direct bonding between silicon and copper. The successful candidate will conduct experimental research, including material characterization and the validation of package-level cooling demonstrators. This role is situated in an interdisciplinary environment, collaborating with academic and industrial partners to advance semiconductor packaging technology.
What you'll do
- Design and optimize novel interlayer alloy feedstocks for multi-material additive manufacturing.
- Develop and refine multi-material Laser Powder Bed Fusion (LPBF) processes.
- Conduct material characterization using SEM, EBSD, XRD, and thermal conductivity analysis.
- Perform thermo-mechanical testing to evaluate interfacial physics and residual stress.
- Fabricate and validate package-level cooling demonstrators for semiconductor applications.
- Collaborate with industrial partners in semiconductor packaging and powder production.
- Contribute to high-impact scientific publications and project reporting.
Requirements
Degree required: Master’s degree in Mechanical Engineering, Materials Science and Engineering, or a related discipline.
Degree offered: PhD
Language: English; excellent proficiency required.
Instruction: English
- Strong analytical and experimental problem-solving skills.
- Ability to work independently and within an interdisciplinary team.
- Excellent written and spoken English communication skills.
- Motivation for both fundamental research and industrial application.
Funding & terms
How to apply
Deadline: 2026-11-01
Submit your application via the official portal using the 'Apply Now' button. Ensure your application includes a cover letter, a detailed CV with references, and academic transcripts.
- Cover letter
- CV
- BSc + MSc transcripts
- 3 reference letters
Contact
Davoud Jafari
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