PhD in Novel Metallurgy for Low-Temperature Hybrid Bonding in Fan-Out Wafer Packaging
Investigate innovative low-temperature hybrid bonding metallurgy for advanced semiconductor packaging.
Best for:Best for chemistry or materials science graduates with an interest in semiconductor packaging and metallurgy.
Overview
This doctoral position focuses on developing novel metallurgy solutions for low-temperature hybrid bonding in Fan-Out Wafer Level Packaging applications. Hosted in France within the Grand Est region, the research addresses critical challenges in microelectronics fabrication and advanced materials integration. The successful candidate will conduct experimental investigations, collaborate with academic and industrial partners, and contribute to scientific literature in the field of chemistry and materials science. Applicants are expected to hold an appropriate academic degree and demonstrate a strong background in materials chemistry or related disciplines.
What you'll do
- Conduct experimental research on novel metallurgy for hybrid bonding processes
- Optimize low-temperature bonding techniques for Fan-Out Wafer Level Packaging
- Characterize interfaces and materials using advanced analytical and spectroscopic methods
- Analyze experimental data and present findings to project partners and academic audiences
- Draft scientific publications for peer-reviewed journals and international conferences
Requirements
Degree required: Master's degree in Chemistry, Materials Science, or equivalent
Degree offered: PhD
Language: Proficiency in English or French
Instruction: English or French
- Strong background in materials science, chemistry, or metallurgy
- Experience with laboratory experimentation and materials characterization techniques
- Ability to analyze complex datasets and draw scientific conclusions
- Good communication skills for reporting and publishing research results
- Applicants must hold a relevant Master's degree or equivalent qualification recognized for doctoral enrollment
Funding & terms
How to apply
Deadline: 2026-11-21
Interested candidates should submit their application through the official doctoral portal before the specified deadline. Ensure all required academic and personal documents are attached for review.
- CV
- Cover letter
- Transcripts
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