PhD Monitor
/Detail
Computer Engineering● OpenPreview

PhD in Quality-of-Service-Aware Architectures for Shared Memory Chiplets in Multi-Die Systems

Develop advanced shared-memory architectures for scalable and predictable multi-die chiplet performance.

Best for:Best for candidates with a strong background in computer architecture, chiplet design, and cache coherence protocols.

imec · Heilbronn, Germany · R1 · First-stage researcher
More professors at imec
Computer ArchitectureChiplet DesignShared Memory SystemsQuality of ServiceCache CoherenceMulti-die Systems
Deadline
N/A
Funding
—
Start date
flexible
Temporary
Location
Heilbronn
Germany

Overview

This PhD position at imec focuses on the design and optimization of Quality-of-Service (QoS) aware architectures for shared-memory chiplets within multi-die systems. The successful candidate will work on developing solutions that ensure scalable and predictable performance in complex heterogeneous computing environments. The research involves a combination of architectural design, simulation, and RTL implementation. Applicants are expected to contribute to the advancement of chiplet-based system design through rigorous technical research.

Computer ArchitectureChipletsRTLSystem SimulationHeterogeneous ComputingMemory Hierarchy

What you'll do

  • Design and evaluate QoS-aware architectures for shared-memory chiplet systems.
  • Develop and implement architectural models using simulation tools.
  • Perform RTL design and verification for proposed architectural components.
  • Analyze system performance and scalability in multi-die configurations.
  • Document research findings and contribute to academic publications.

Requirements

Degree required: MSc in Electrical Engineering, Computer Science, or a related field.

Degree offered: PhD

Language: English proficiency required.

Instruction: English

Required skills
  • Strong understanding of computer architecture principles.
  • Experience with chiplet-based system design.
  • Proficiency in cache coherence protocols.
  • Experience with hardware simulation and RTL design.
Nice to have
Experience with performance modeling and analysis.Familiarity with multi-die interconnect technologies.Background in high-performance computing architectures.

Funding & terms

Type
Unknown
Amount
—
Duration
—
Programme
—

How to apply

Deadline: N/A

Interested candidates should submit their application materials directly through the provided portal. Ensure all required academic and professional documentation is included for review.

Documents required
  • CV
  • Academic transcripts
  • Cover letter
↗Open application page
See the full position

Create a free profile to unlock your personal match score, the full requirements, funding details and how to apply — in English or Persian.

No card · 10 free AI match scores
Ready to apply?
Open this position on its website, or save it for later.